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WOS核心合集引用: 72 2023影響因子: 2.3 发表年影響因子: 0.977
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2014, Volume 27, Issue 2, Pages 192-203
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WOS核心合集引用: 35 2023影響因子: 2.3 发表年影響因子: 1.000
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2014, Volume 27, Issue 4, Pages 462-474
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WOS核心合集引用: 36 2023影響因子: 2.3 发表年影響因子: 1.000
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2015, Volume 28, Issue 1, Pages 117-125
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WOS核心合集引用: 55 2023影響因子: 2.3 发表年影響因子: 1.045
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WOS核心合集引用: 28 2023影響因子: 2.3 发表年影響因子: 1.045
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2017, Volume 30, Issue 3, Pages 261-269
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WOS核心合集引用: 15 2023影響因子: 2.3 发表年影響因子: 1.336
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2008, Volume 21, Issue 2, Pages 224-237
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WOS核心合集引用: 176 2023影響因子: 2.3 发表年影響因子: 0.957
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2010, Volume 23, Issue 1, Pages 53-64
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WOS核心合集引用: 65 2023影響因子: 2.3 发表年影響因子: 0.977
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