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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2012, Volume 25, Issue 3, Pages 432-446
收錄情况: WOS SCOPUS
WOS核心合集引用: 86 2023影響因子: 2.3 发表年影響因子: 0.862
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2013, Volume 26, Issue 1, Pages 100-110
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WOS核心合集引用: 65 2023影響因子: 2.3 发表年影響因子: 0.977
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2013, Volume 26, Issue 4, Pages 578-591
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WOS核心合集引用: 72 2023影響因子: 2.3 发表年影響因子: 0.977
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2014, Volume 27, Issue 2, Pages 192-203
收錄情况: WOS SCOPUS
WOS核心合集引用: 35 2023影響因子: 2.3 发表年影響因子: 1.000
5.How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2014, Volume 27, Issue 4, Pages 462-474
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WOS核心合集引用: 36 2023影響因子: 2.3 发表年影響因子: 1.000
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2015, Volume 28, Issue 1, Pages 117-125
收錄情况: WOS SCOPUS
WOS核心合集引用: 55 2023影響因子: 2.3 发表年影響因子: 1.045
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2015, Volume 28, Issue 2, Pages 160-170
收錄情况: WOS SCOPUS
WOS核心合集引用: 28 2023影響因子: 2.3 发表年影響因子: 1.045
8.Scheduling Transient Processes for Time-Constrained Single-Arm Robotic Multi-Cluster Tools
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2017, Volume 30, Issue 3, Pages 261-269
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WOS核心合集引用: 15 2023影響因子: 2.3 发表年影響因子: 1.336
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IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING[0894-6507], Published 2018, Volume 31, Issue 2, Pages 196-205
收錄情况: WOS SCOPUS
WOS核心合集引用: 17 2023影響因子: 2.3 发表年影響因子: 1.140
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