排序方式:
1.Optimally Scheduling Dual-Arm Multi-Cluster Tools to Process Two Wafer Types
Zhu, QH, Wang, GH, H
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Zhu, QH, Wang, GH, Hou, Y, Wu, NQ, Qiao, Y
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IEEE ROBOTICS AND AUTOMATION LETTERS[2377-3766],
Published 2022,
Volume 7,
Issue 3,
Pages 5920-5927
收錄情况:
WOS
SCOPUS
WOS核心合集引用: 13
2023影響因子:
4.6
发表年影響因子:
5.2
2.Scheduling of Time-Constrained Single-Arm Cluster Tools with Two-Space Process Modules in Semiconductor Manufacturing
Zou, CY, Wang, GH, G
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Zou, CY, Wang, GH, Gu, L, Li, J, Wu, NQ, Qiao, Y
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IEEE ROBOTICS AND AUTOMATION LETTERS[2377-3766],
Published 2024,
Volume 9,
Issue 7,
Pages 6352-6359
收錄情况:
WOS
SCOPUS
WOS核心合集引用: 2
2023影響因子:
4.6