1.Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Zhang, W, Brongersma
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Zhang, W, Brongersma, SH, Li, Z, Li, D, Richard, O, Maex, K
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JOURNAL OF APPLIED PHYSICS[0021-8979],
Published 2007,
Volume 101,
Issue 6,
收錄情况:
WOS
SCOPUS
WOS核心合集引用: 82
2023影響因子:
2.7
发表年影響因子:
2.171